Henkel Japan Targets Full-Scale Launch of New Packaging Adhesive

Henkel Japan Ltd. has started a full-scale rollout this month of Technomelt Supra Cool, a series of hot-melt adhesives that can be applied at low temperature and are intended for use with packaging. First made available last year, the series is targeted primarily toward use in the assembly of cardboard cases, small boxes and so on. Technomelt Supra Cool has…

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